Automated Optical Inspection (AOI) & Solder Paste Inspection (SPI) Systems

The need for inspection exists in most manufacturing processes, especially in the automotive industry where tough quality and safety standards apply. What is needed is a reliable AOI system that provides maximum inspection coverage and measured feedback to the process. As a company with more than 40 years experience in both factory automation and the printed circuit board production environment, Omron is able to use this knowledge to deliver the right AOI solution for todays ever demanding market.

Automatic Optical Inspection systems for component inspection as well as Solder paste inspection (AOI & SPI)

Omron’s patented COLOUR HIGHLIGHT TECHNOLOGY

High resolution 3-CCD camera method for higher accuracy

VT-RNS-PTH

Higher performance for a new dimension in desktop PCB inspection

Designed for off-line inspection, the VT-RNS-ptH is an ideal solution for smaller manufacturers running low volume or prototyping assembly lines. The inspection algorithms used in the VT-RNS-ptH are identical to the fully automated in-line machine, the VT RNS.

The system uses Omron’s patented three colour highlight system which has proven so successful. This lighting system illuminates the target from all angles and in all directions in a 360 degrees dome (dome illumination). The advantage of dome illumination is that it enables stable performance of inspection regardless of component placement directions or other angle designs. In high-density placement applications, the reflective luminosity of the solder surface is diminished by the shadows of adjacent components.

Features:

• Simple AOI Operation
• Patented Three-Color Highlight Technology
• High Resolution Inspection
• Easy Programming with Automatic Teaching
• User Friendly Installation
• Statistical Analysis
• CAD Import
• OCV Function

Omron VT RNS model can be easily configured to perform three different types of printed circuit board inspections, making the VT RNS a very flexible machine that can be used to inspect PCBs at post paste, post placement or post solder stages.

• Post solder (S model): RNS can be set up to automatically inspect both post reflow and post wave printed circuit board assemblies.
• Post placement (Z model): with a simple software change, RNS can be used to inspect 'placed or mounted' components prior the soldering process.
• Post paste (P model): for 2D paste inspection, this version of the machine can be set up through a simple software change

Features:

• Patented three color highlight AOI technology
• Data analysis function
• User-friendly software and installation
• OCV function
• Network compatible
• Lead-free enabled

VT-WIN II

VT-WIN II Post Solder Inspection

Omron's VT WIN II combines innovative AOI technologies, unrivaled speed and easy to use functionality that offers advances in solder inspection, component fault detection and process speed to provide a competitive edge in improved productivity, waste reduction and quality control. Omron's commitment to continuous improvement and AOI innovation assures a steady stream of advancements and new features have been added to further improve our latest VT WIN II machines.

Omron's exclusive angled-view inspection lets you operate at a 20-degree angle. Improved inspection algorithms, including user-customized ones, ensure reliable results from the most challenging board layouts.

Features:

• High resolution color camera with increased field of view
• Unique RGB color highlight technology
• Eight magnification levels from 10 to 50 microns
• Angle view for lifted lead and J lead inspection
• Ultra high-speed solder and component inspection
• 0.1 degree rotated component inspection
• Flexible inspection logic with improved user interface
• Enhanced lead free solder capability
• Network and database capabilities
• In-line and off-line operation
• Angle view inspection

SPI-CKD

VP Series - 3D Solder Paste Inspection

With VP series full 3D, paste inspection of all pads is designed to offer high-speed AOI, high precision 3D inline inspection with maximum throughput. The 3 CCD camera is placed vertically to the solder and the projector radiates a colored stripe light pattern at an angle above the object. The amount of the deviation of the projected stripe pattern from the object is converted into the height, according to the triangulation principle. Because the solder printed on the substrate is measured in the plane, the inspection speed is fast. The color stripe phase shifting is adopted to create 3D images by projecting RGB patterned light.

Features:

• High speed 100% analysis of solder paste
• Accurate 3D volume inspection technology
• 8 magnification levels up to 10 microns
• Simple conversion of Gerber data for easy programming
• Off-line programming and data analysis
• 2D code reading (optional)