ITW MPM – Semiconductor Assembly solution - Edison II ACT
The Edison II ACT is a next-generation stencil printer designed for semiconductor assembly applications, offering industry-leading precision and process control. With breakthrough features that enhance alignment, wipe performance, and yield, it sets a new benchmark in ultra-thin stencil printing for advanced packaging and miniaturized electronics.
Overview
The ITW MPM Edison II ACT delivers exceptional performance for semiconductor assembly with a machine design focused on ultra-tight coplanarity between stencil and substrate—critical for ultra-thin stencil applications. Its advanced alignment system compensates for board stretch while ensuring accurate positioning. A high-precision load-cell with motor-driven closed-loop control maintains consistent print force throughout the stroke. With alignment accuracy of ±8 microns (≥2 Cpk @ 6σ), Edison II ensures superior yield and quality in the most demanding print environments. An innovative, patented wipe system and the industry’s largest paper roll further enhance its suitability for fine-feature and high-volume production.
Features
- Ultra-Tight Coplanarity: Optimized design improves yield for ultra-thin stencil printing applications.
- Advanced Alignment System: Enables precise board alignment and compensates for board stretch.
- High Precision Print Force: Load-cell with closed-loop motor control ensures uniform force across the stroke.
- Superior Accuracy: ±8 μm alignment accuracy on Edison II; ±11 μm on Momentum II (≥2 Cpk @ 6σ).
- Patented Wipe System: Delivers enhanced cleaning for super-fine apertures and critical print applications.
- Extended Operation: Edison’s large-capacity paper roll enables longer shifts without paper replacement.
- Designed for Semiconductors: Built for precision-driven environments like semiconductor assembly and microelectronics.
Specifications
- Model: Edison II ACT
- Application: Semiconductor Assembly
- Alignment Accuracy: Edison II: ±8 μm , Momentum II: ±11 μm
- Both at ≥2 Cpk @ 6σ
- Print Force Control: Load-cell based, closed-loop motor-driven system
- Coplanarity: Ultra-tight stencil-to-substrate for ultra-thin stencil applications
- Wipe System: Patented enhanced cleaning system
- Paper Roll Capacity: Industry’s largest—lasts beyond one shift
- Use Cases: Ultra-fine pitch, semiconductor packaging, advanced electronics