Leaptech
Main Image
Thumb 1 Thumb 2 Thumb 3

ITW MPM – Semiconductor Assembly solution - Momentum II BTB

The MPM® Momentum® II BTB is a compact, dual-lane stencil printer designed for superior throughput and flexibility in SMT production. Its Back-to-Back (BTB) configuration delivers all the performance of the Momentum platform while optimizing factory floor space and increasing line efficiency.

Overview

The Momentum II BTB builds upon the proven Momentum platform with a smaller footprint and a unique Back-to-Back configuration that supports dual-lane processing. This setup enables manufacturers to print multiple board types—such as top and bottom sides, same-side, or mother/daughter boards—within the same SMT line. It provides greater production flexibility and improved line balancing without additional floor space or capital investment. With two throughput configuration options, the BTB is engineered for adaptability while maintaining the exceptional accuracy, speed, and reliability the Momentum series is known for.

Features

  • Compact Dual-Lane Design: Back-to-Back configuration enables dual-lane printing in limited space.

  • Multi-Product Flexibility: Supports printing of different board types on the same line—top/bottom, same side, or multi-board.

  • Space-Efficient Footprint: Smaller than the standard Momentum model, ideal for space-constrained environments.

  • Flexible Throughput Options: Offered in two configurations to support line balancing needs.

  • High Alignment Accuracy: ±11 μm @ 6σ, Cpk ≥2.0 ensures consistent and precise board registration.

  • Reliable Wet Print Performance: ±17 μm @ 6σ, Cpk ≥2.0 for superior print quality across all applications.

  • Proven Momentum Platform: Leverages the core design, reliability, and options of the Momentum series.

  • Ideal for High-Mix Production: Designed to handle multiple product types with minimal changeover.

Specifications

  • Configuration: Back-to-Back dual-lane processing
  • Footprint: Smaller than standard Momentum platform
  • Throughput Modes: Available in two configurations for optimal line balancing
  • Alignment Accuracy: ±11 μm @ 6σ, Cpk ≥2.0
  • Wet Print Accuracy: ±17 μm @ 6σ, Cpk ≥2.0
  • Flexibility: Supports top/bottom, same side, and mother/daughter board processing
  • Platform Compatibility: Shares features and options with the full Momentum printer line
  • Application Use: High-volume SMT lines, high-mix product environments, dual-lane efficiency setups

Ready to boost your production with ITW MPM – Semiconductor Assembly solution - Momentum II BTB?

Get in Touch

Your Future Awaits, Let's Talk Strategy

Know More