VISCOM 3D AXI Pioneering 3D X-ray Inspection for Flat Assemblies
Pioneering 3D X-ray Inspection for Flat Assemblies The VISCOM iX7059 PCB Inspection and iX7059 PCB Inspection XL are compact 3D AXI systems engineered for high-precision inspection of flat assemblies, providing reliable detection of soldering defects like head-in-pillow and pores in BGA and LGA components.
Overview
For extra-large PCB assemblies up to 1,600 mm, the iX7059 PCB Inspection XL with its extended longboard option is the perfect fit — ideal for server boards, LEDs, semiconductors, and 5G electronics. The system ensures 100% quality assurance in modern SMT production by accurately detecting hidden defects, even under massive shadowing effects caused by complex assemblies.
Features
- High-Precision Defect Detection: Identifies head-in-pillow, pores, and voids in BGA and LGA components.
- Large PCB Capability: XL model supports PCB assemblies up to 1,600 mm.
- Complete Quality Assurance: Inspects SMD and THT solder joints with exact void measurement.
- Dynamic Image Acquisition: Features Evolution 4 or optional Evolution 5 for superior speed and throughput.
- Shadowing Compensation: Detects hidden defects even in complex, shadowed areas.
- Versatile Applications: Suited for server boards, LED modules, semiconductors, and 5G electronics.
Specifications
- System Models: iX7059 PCB Inspection / iX7059 PCB Inspection XL
- Max PCB Size (XL): Up to 1,600 mm
- Inspection Focus: SMD, THT solder joints, BGA, LGA voids
- Imaging Technology: Evolution 4 / Evolution 5 dynamic image acquisition
- Defect Detection: Head-in-pillow, pores, voids
- Industries: Servers, LED, Semiconductor, 5G Electronics