VISCOM 3D Reliable Inspection of Power Semiconductors – iX7059
Precision 3D X-ray Inspection with Computed Tomography The VISCOM iX7059 Module Inspection system provides seamless and reliable quality assurance specifically for power semiconductors. This fully automatic 3D X-ray system with integrated computed tomography (CT) delivers easy-to-classify, accurate layer inspection images and supports a large inspection scope.
Overview
Optimized for frame-based power modules or components on workpiece carriers, the iX7059 Module Inspection ensures flawless handling within a compact design, making it easily integrable into production lines. Designed for smart factory environments, it offers intelligent void checking to ensure flawless heat dissipation and features additional vertical slices for deeper analysis and reliable verification.
Features
- 3D X-ray with Computed Tomography: Enables detailed and accurate layer inspections.
- Intelligent Void Checking: Ensures efficient heat dissipation in power semiconductors.
- Vertical Slice Analysis: Additional slicing for optimal analysis and dependable verification.
- Smart Factory Ready: Supports intelligent networking and integration.
- Versatile Handling: Processes frame-based power modules and workpiece carrier components with ease.
- Compact & Line Integrable: Small footprint, easily added to existing production lines.
- Fast Program Creation: Utilizes 3D analysis and an IPC-compliant AXI inspection library for rapid setup.
Specifications
- Inspection Type: 3D X-ray with integrated computed tomography
- Application: Power semiconductors, frame-based modules, workpiece carrier components
- Capabilities: Void checking, vertical slice analysis
- Integration: Compact system, smart factory compatible
- Programming: 3D analysis, IPC-compliant AXI inspection library