YAMAHA – YSB 55W (High-Speed & High-Accuracy Flip Chip Bonder)
The Yamaha YSB 55W is a high-speed, high-accuracy flip chip bonder that delivers triple the productivity of conventional machines. It supports the expanding flip chip market with advanced precision and efficiency. Featuring 8-die simultaneous pickup and transfer, it achieves up to 13,000 UPH. The in-house developed MACS (Multiple Accuracy Compensation System) achieves bonding accuracy of ±5μm (3σ). Standard features include a wafer feeder with wafer expander and theta alignment mechanism.
Overview
The YSB 55W delivers high bonding accuracy and three times the productivity of conventional machines. It supports the growing demand for high-performance flip chip packaging. The upgraded MACS system ensures ±5μm (3σ) accuracy with original heat analysis and compensation algorithms for consistent placement. Its structure is designed based on meticulous analysis and testing for high-precision accel-decel drive. A wafer feeder with expander and theta alignment mechanism comes standard.
Features
- High bonding accuracy and triple the productivity of conventional machines
- 8-die simultaneous pickup and simultaneous transfer
- Achieves 13,000 UPH
- ±5μm (3σ) bonding accuracy
- Upgraded MACS (Multiple Accuracy Compensation System)
- Original heat analysis and compensation algorithm for placement accuracy
- Wafer feeder with wafer expander and theta alignment mechanism
- Meticulous structural analysis and testing for precise accel-decel drive
Specifications
- Model: YSB 55W
- Type: High-speed & high-accuracy flip chip bonder
- Bonding Accuracy: ±5μm (3σ)
- Productivity: 13,000 UPH
- Pickup Method: 8-die simultaneous pickup & transfer
- Compensation System: Upgraded MACS
- Thermal Control: Heat analysis & compensation algorithm
- Wafer Handling: Feeder with wafer expander & theta alignment (standard)
- Structural Design: Tested for high-precision accel-decel drive