ITW – CAMALOT PRODIGY - Underfill
- Underfill is used in a wide variety of packages and board-level assemblies, and Camalot® dispense machines, particularly the Smart Stream® pump technology, perform fast, efficient, complete underfill for all types of packages reliably and repeatably.
- Underfill is dispensed and flowed under flip chips, direct chip attach on boards, stacked die packages, and various ball grid array (BGA) components where, once cured, stabilizes the component.
ITW – CAMALOT PRODIGY - Edge/Corner Bonding
- Camalot® precision dispense technology ensures successful application of adhesives for both corner/edge bonding processes.
- Edge/corner bonding is used as an alternative to underfill to add mechanical strength and reliability to BGAs and similar chip-scale packages (CSPs) and to increase reliability for drop testing. Corner/edge bonding is dispensed post-reflow and cured with an additional process (oven).
- The adhesive material must be precisely dispensed to wet the edge of the component while minimizing flow underneath, a level of dispense control that defines Camalot machines.